A strategy of wafer-level-plastic-packaging for MEMS based on adhesive bonding;
基于粘附剂键合的圆片级MEMS塑料封装技术
Electrostatic-alloy bonding technique used in MEMS;
MEMS中的静电-热键合技术
Application of laser fusing bonding of silicon/glass in a novel uncooled infrared detector;
激光熔融键合在新型室温红外探测器的应用
Studies on Photosensitive Dyes Binding to Monocrystalline Germanium Surface;
单晶锗表面键合光敏染料的研究
Binding of Ionic Derivative of Pyrene to Strong Polyelectrolyte;
强聚电解质对离子型芘衍生物探针的键合
Studies of photosensitive dyes binding to monocrystalline germanium surface;
单晶锗表面键合光敏染料及其电流-电压曲线的测定
The defect distribution of bonded wafers and its relationship to the Weibull modulus;
硅片键合界面缺陷分布与Weibull模数的关系
Study on a New Al-1%Si Bonding Wire for Encapsulation of Integrate Circuit;
集成电路封装用新型Al-1%Si键合线的研制
3 mm) was bonded directly on an aluminum nitride substrate by heating.
通过高温热氧化的方法 ,在AlN陶瓷表面形成一薄层Al2 O3作为过渡层 ,成功地将铜与AlN陶瓷键合在一起 ,研制出性能优越的AlN陶瓷覆铜基板 。
<Abstrcat> Some measurement methods of wafer bonding strength were summarized.
对现有的几种硅片键合强度测试方法进行总结,在裂纹传播扩散法测试机理分析的基础上,提出了测试系统需要得到的参数和功能。
Interfacial thermal stresses distribution and value in InP/Si wafer bonding are investigated both theoretically and experementally.
通过实验和理论计算,分析了InP/Si键合过程中,界面热应力的分布情况、影响键合结果的关键应力因素及退火温度的允许范围。
Thermal stress distribution in wafer bonding of InP/GaAs after annealing is investigated by combining finite element method(FEM) with the ANSYS program.
用有限元方法结合ANSYS工具,研究了InP/GaAs键合在退火后的热应力分布图像。
reverse bonded-phase chromatography
反键合相色谱(法)
The bond in which the linkage pair of electrons are providedby one of the bonding atoms.
一个键合原子用以联结一对电子的键。
Bond strength is an important parameter for wafer bond.
键合强度是关系到键合好坏的一个重要参数。
Research on the Factors Affecting the First Bond of Ultra-Fine Pitch Wire Bonding Process;
超细间距引线键合第一键合点影响因素研究
Study on the Preparation and Ball Bonding Process for the High-Performance Copper Bonding Wire
高性能键合铜丝的制备及其球键合工艺研究
Influence of Silicon/Glass-ceramic Anodic Bonding Technology on Bonding Intensity
硅/微晶玻璃阳极键合工艺对键合强度的影响
Modeling of the hybrid system with the HBG in MBD;
MBD中通过混合键合图对混合系统建模
LBA-203 Bonding Agent Synthesis and Properties
LBA-203键合剂的合成及其性能研究
Design and synthetic route of bonding agents containing polyether of heretocycle amide
聚醚环酰胺键合剂的设计及合成路线
Investigation on Anodic Bonding Influence Factors and Preparation of Glass-creamic Used as Anodic Bonding;
阳极键合用微晶玻璃的制备及键合影响因素研究
Design of High Voltage Pulse Power for Anodic Bonding and Study on the Processing Property of Bonding;
阳极键合高压（脉冲）电源设计及键合工艺特性分析
Design of High-frequency Ultrasonic Transducer for Wire Bonding and Research on Motion Control of Bond Head
引线键合高频超声换能器的设计和键合头运动控制研究
The three dimensional temperature distribution of laser bonding with a Gaussian thermal source is modeled using the finite element method.
在硅／玻璃激光键合中，温度场的分布是影响晶片能否键合的关键因素。
glucosidic linkage
糖苷键[合],苷键[合]
This key combination is not valid. Key combinations must consist of zero or more modifier keys and a single key.
该组合键无效。组合键必须由零或多个组合键和一个单键组成。
Common Logo Combined Keys in Windows
最常用的Windows徽标组合键
To assign a keystroke to the selected button, type the shortcut key combination in the box.
要将键击指派给所选的按钮，请在框中键入快捷键组合。
"Do you want to press keys in key combinations one at a time?
"在使用组合键时，选择一次只按一个键的方式吗?