The coating quality problems,which were caused by improper pretreatment for electroplating of the microelectronics packages,are discussed in the paper.
讨论了微电子封装外壳电镀前处理不良引起的镀层质量问题,特别对封装外壳污染物的种类以及污染程度的影响提出了相应的前处理措施。
