Accordling to the basic principle of GB10574-89,the method of determination of tin in tin-lead solders was studied further.
本文根据GB10 5 74- 89《碘酸钾滴定法测定锡量》的基本原理 ,对锡铅焊料中锡的测定方法做了进一步探讨。
Analysis of ancient Pb-Sn solder in China
中国古代铅锡焊料的分析
The Tin saved Sn-Pb solder which Tin content decreased 10% than common Sn-Pb solder HL610 is introduced, the braze ability, mechanical properties, oxidation-resistance are better than HL610.
研究了含锡量比普通HL61 0锡铅焊料降低 1 0 % ,而焊接性能、机械性能、抗氧化性能均优于HL61 0的节锡锡铅焊料 。
Casting tin-lead solders
GB/T8012-1987铸造锡铅焊料
Experimental Study on Cyclic Behavior of Eutectic Tin-Lead Solder under Multiaxial Loading;
多轴载荷下共晶锡铅焊料的循环性能实验研究
Tin-lead solders-Determination of tin content-Potassium iodate titrimetric method
GB/T10574.1-1989锡铅焊料化学分析方法碘酸钾滴定法测定锡量
Tin-lead solders-Determination of cadmium content-Catalytic oscillopolarographic method
GB/T10574.12-1989锡铅焊料化学分析方法催化示波极谱法测定镉量
Tin-lead solders-Determination of bismuth content -Thiourea spectrophotometric method
GB/T10574.4-1989锡铅焊料化学分析方法硫脲分光光度法测定铋量
Tin-lead solders-Determination of sulphur content-Oscillopolarographic method after distillation
GB/T10574.14-1989锡铅焊料化学分析方法蒸馏示波极谱法测定硫量
Tin-lead solders-Determination of silver content -Potentiometric titrimetric method
GB/T10574.9-1989锡铅焊料化学分析方法电位滴定法测定银量
Tin-lead solders-Determination of arsenic content -Molybdoantimony-arsenate blue spectrophotometric method
GB/T10574.6-1989锡铅焊料化学分析方法砷锑钼蓝分光光度法测定砷量
Tin-lead solders-Determination of antimony content -Potassium bromate titrimetric method
GB/T10574.3-1989锡铅焊料化学分析方法溴酸钾滴定法测定锑量
Tin-lead solders-Determination of silver content-Flame atomic absorption spectrophotometric method
GB/T10574.8-1989锡铅焊料化学分析方法火焰原子吸收光谱法测定银量
Tin-lead solders-Determination of zinc content-Flame atomic absorption spectrophotometric method
GB/T10574.10-1989锡铅焊料化学分析方法火焰原子吸收光谱法测定锌量
Tin-lead solders-Determination of antimony content- Malachite green spectrophotometric method
GB/T10574.2-1989锡铅焊料化学分析方法孔雀绿分光光度法测定锑量
tin-lead 60-40 solder
锡铅60-40焊料
Pb-free solders ? Sn-Bi-Zn based with our own patent and their modification to fit for package applications.
无铅焊锡—锡铋锌系无铅焊锡，材料设计、开发，焊料（锡球、锡膏）开发等。
Pb-free solders– Sn-Bi-Zn based with our own patent and their modification to fit for package applications.
无铅焊锡—锡铋锌系无铅焊锡，材料设计、发，焊料（球、膏）发等。
High precision welding materials pure tin lead alloy products.
高级精密焊接纯锡铅合金材料制品。
Tin-lead solder in the manufacture of professional audio equipment.
用于制造专业音响设备的铅锡焊料。
Soldering materials are our major products, especially in Lead Free Soldering Materials.
焊锡物料是我们的主要产品，特别是无铅焊锡物料。