Effects of Ce on spreadability of Sn-Cu-Ni lead-free solder and mechanical properties of soldered joints;
稀土元素Ce对Sn-Cu-Ni无铅钎料铺展性能及焊点力学性能的影响
Effects of Ce on physical properties and spreadability of Sn-Cu-Ni solder;
稀土Ce对Sn-Cu-Ni钎料物理性能和铺展性能的影响
The results show that silver filler metals with excellent spreadability and sound mechanical properties of brazed joint can be developed by optimizing the compositions of silver filler metals with gallium.
研究了不同镓含量银钎料的铺展性能、钎缝力学性能以及钎料的显微组织变化规律。
The properties of 16 kinds of organic activator were tested by means of witting angle and spreading property.
通过润湿角和铺展性表征对16种有机活性剂进行了性能测试,用热失重法测试其热解过程,对所选活性剂进行复配处理完成表面包覆并制得活性物质。
By means of optical microscopy, electrical conductivity measuring device and temperature measuring device, the microstructure, electrical conductivity ,solidus temperature, spreading property of solder were analyzed.
用光学显微镜、电导仪、热分析仪等对合金的微观组织、电导率、熔点、铺展性能进行了分析,并与Sn37Pb进行了对比。
Compared with polycrystalline Cu, the as-cast single crystal copper shows better plasticity and extensibility, and has a lower electricity resistance.
结果表明 :和多晶铜相比 ,单晶铜在铸态时具有良好的塑性和较低的电阻率 ,并具有优异的室温延展性 ,其延伸率可达 6 10 0 %以上 ;冷拉拔加工后单晶铜表现出更大的加工硬化现象 ,但采用合理的退火工艺可使其加工硬化得到缓解。
Design of FRPs in Circular Bridge Column Retrofits for Ductility Enhancement;
纤维增强复合材料提高圆形桥柱延展性的修复设计
The improvement of low temperature ductility and fracture strength of dopted Mo alloys by doping with trace carbon was described in this paper.
本文叙述了通过在掺杂钼中添加微量碳 ,改善掺杂钼板的断裂强度和低温延展
It was found that they have effects on plating rate,ductility and antiwear of copper layer.
通过在化学镀铜液中分别添加亚铁氰化钾、２ＭＢＴ及２，２’－联吡啶三种添加剂的实验研究，探讨了添加剂种类及其加入量对镀铜速度和镀铜层延展性产生显著影响的原因。
The effect of Cu, In, Bi, S on the melting point and the spread-ability of Sn/Ag based lead-free solder was studied.
研究了Cu、In、Bi、S元素对Sn-Ag基无铅焊料熔点和铺展性的影响。